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Wafer Technology
SCHOTT Electronic Packaging focuses on the customer-specific micro-structuring of (ultra-thin) wafers with through-holes, blind holes, cavities and channels with diverse depth requirements on both sides of a wafer.
Wafers are produced by floating or down-drawing, allowing the use of various special glass types. After cutting and polishing, the wafers are structured under clean room condition. By sandblasting or ultrasonic drilling, the wafers receive their customer-specific micro-structures. Then the wafers are cleaned and packed under clean room conditions class 1,000.
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Advantages of the Technology
- Compared to polymers, glass is hydrophilic, robust, chemically and highly temperature resistant
- Compared to silicone, glass is less costly and offers an optimum CTE to match the silicone as well as high isolation and excellent optical properties
- SCHOTT offers standard glasses such as AF45™, D263™, BF33™, B270™ and AF371™ as well as a wide range if other glass types according to customer specific requirements
- Micro-structured wafers are produced under clean room conditions (Clean Room Class 10,000 ISO Category 7; US Federal Standard 209E; DIN EN 150 14644-1) and packed under clean room conditions class 1,000.
Applications
SCHOTT offers micro-structured wafers made of different glass types that are used in applications such as:
- Micro-fluidic devices for medical analysis, drug testing, industrial monitoring and ink-jet printing
- Micro-Electro-Mechanical Systems (MEMS)
- Organic Light Emitting Diodes (OLED)
- Customer-specific applications
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Контактные данные
SCHOTT Electronic Packaging GmbH
Christoph-Dorner-Strasse 29
84028 Landshut
Germany
 | +49 (0)871/826-0 |
 | +49 (0)871/826-400 |
Эл. почта
Дополнительные контакты
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