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MEMS Packaging


Micro-Electro-Mechanical systems (MEMS) are a type of technology related to very small (micron size) mechanical elements or 'machines.' They are widely used as sensors and switches in the automotive and avionics industries as well as in biomedical applications and data communication.

The package is one of the most important components of a MEMS solution. It protects the functional unit (sensor, integrated circuit (IC) or micromechanical component) against disruptive external influences.

We offer
  • Glass cover discs for cavity packaging
  • Small glass-to-metal sealed (GTMS) packages with cavities (DIPs, TO, Thin Metal)
  • Hermetic packages for the encapsulation of electronic components and quartz crystals
  • SCHOTT HermeS®, a packaging innovation specially designed for MEMS


SCHOTT HermeS®
Specially designed for use in MEMS, SCHOTT HermeS® offers superior hermeticity and enhanced electrical properties... [more]
TO Headers
Providing a mechanical basis for the installation of electronic and optical components such as semiconductors, laser diodes or simple electronic circuits, while at the same time providing power to the encapsulated components with the aid of pins, TO headers... [more]
Glass Discs
SCHOTT offers small glass windows for a variety of optical and optoelectronic applications... [more]
Frequency Control
Quartz crystals are sensitive components found within time control devices. Demanding environmental conditions can severely impair their performance. SCHOTT offers hermetically sealed enclosures to ... [more]
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SCHOTT Electronic Packaging GmbH

Christoph-Dorner-Strasse 29
84028 Landshut
Germany
 +49 (0)871/826-0
 +49 (0)871/826-400
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Trade Fairs & Events

06.03 - 08.03.2012

OFC (Optical Fiber Conference)

Los Angeles

13.03 - 15.03.2012

Medtec 2012

Stuttgart

17.04 - 19.04.2012

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Barcelona

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