HTCC Multilayer Packages & Substrates 

SCHOTT Electronic Packaging is the only company in Europe that supplies all types of hermetic housing technologies. Apart from its signature Glass-to-Metal Sealing technology, SCHOTT has also accumulated strong know-how in the design and manufacture of customized high temperature cofired multilayer ceramic packages and substrates (HTCC). SCHOTT is also able to supply low temperature cofired ceramic (LTCC) housings through its partnership with VIA electronic.

Hermetic multilayer ceramic packages and substrates are ideal for more complex packaging solutions, such as micro-electronic-mechanical systems (MEMS) and high frequency applications because such packages are hermetic and enable a large number of electrical feedthroughs within very small spaces.
Trade Fairs & Events
13.
March
Trade fair OFC 2018, San Diego, CA, USA, 13.03 - 15.03.2018
17.
September
Trade fair Gastech, Barcelona, Spain, 17.09 - 20.09.2018
13.
November
Trade fair electronica, Munich, Germany, 13.11 - 16.11.2018
Contact
SCHOTT AG
Christoph-Dorner-Strasse 29
84028 Landshut
Germany
E-Mail to SCHOTT+49 (0)871/826-0
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