Microelectronic Packages with Glass-to-Metal Sealing (GTMS)

In addition to the standard types of packaging such as TO packaging, there is a whole range of other opto-electronic applications that require special packaging. These range from individual sensors to switching systems that require total encapsulation. Glass-to-metal sealed (GTMS) microelectronic packages (otherwise known as hybrid packages) are manufactured according to the requirements of the components requiring protection and fulfill three vital functions.
 
  • Provide electronic components with power
  • Protect the sensitive modules from harsh environmental conditions
  • Ensure the efficient transmission of optical signals
Trade Fairs & Events
27.
November
Trade fair IBTE 2017, Shenzhen, China, 27.11 - 29.11.2017
13.
March
Trade fair OFC 2018, San Diego, CA, USA, 13.03 - 15.03.2018
17.
September
Trade fair Gastech, Barcelona, Spain, 17.09 - 20.09.2018
13.
November
Trade fair electronica, Munich, Germany, 13.11 - 16.11.2018
Contact
SCHOTT AG
Christoph-Dorner-Strasse 29
84028 Landshut
Germany
E-Mail to SCHOTT+49 (0)871/826-0
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