GTMS Packages

In addition to the standard types of packaging such as TO packaging, there is a whole range of other opto-electronic applications that require special packaging. These range from individual sensors to switching systems that require total encapsulation. Glass-to-metal sealed (GTMS) microelectronic packages (otherwise known as hybrid packages) are manufactured according to the requirements of the components requiring protection and fulfill three vital functions.
  • Provide electronic components with power
  • Protect the sensitive modules from harsh environmental conditions
  • Ensure the efficient transmission of optical signals
News, Trade Fairs & Events
04.
April
Trade fair Gastech Japan 2017, Tokyo, Japan, 04.04 - 07.04.2017
21.
March
Trade fair IDS 2017, Cologne, Germany, 21.03 - 25.03.2017