High Frequency TO and Microelectronic Packages

Data communication networks are becoming increasingly faster. However, data can only be transferred at high speed if all of the components involved are designed for operation at high frequencies. Hence, the easiest way to speed up data transfer rates in communication networks is to replace the transmission and reception components.

Transistor Outlines (TO) and Microelectronic Packages
Hermetically sealed housings for high frequency components come in a range of designs, and enable large volumes of data to be transmitted in existing structures - particularly in TO packages. We produce customized solutions for these areas of application ranging from high-volume TO headers (TO PLUS®) to customized microelectronic (or hybrid) packages.
Trade Fairs & Events
27.
November
Trade fair IBTE 2017, Shenzhen, China, 27.11 - 29.11.2017
13.
March
Trade fair OFC 2018, San Diego, CA, USA, 13.03 - 15.03.2018
17.
September
Trade fair Gastech, Barcelona, Spain, 17.09 - 20.09.2018
13.
November
Trade fair electronica, Munich, Germany, 13.11 - 16.11.2018
Contact
SCHOTT AG
Christoph-Dorner-Strasse 29
84028 Landshut
Germany
E-Mail to SCHOTT+49 (0)871/826-0
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