News

27.10.2017

Enabling Miniaturized High Frequency Interposers

SCHOTT HermeSⓇ Through Glass Via substrates now available for chip-size RF interposer applications.
HermeS® Through Glass Vias (TGV) wafers are now available with high via density and extremely small via pitch of up to 90.000 vias per wafer in a matrix layout. This opens new possibilities for miniaturized interposers in wafer level chip size packaging (WL-CSP). HermeS® substrates also offer superior RF properties: they combine the low dielectric constant of glass with highly conductive, hermetically-sealed solid metal vias to enable superior electrical and thermal performance.

For further information, please visit the HermeS website or contact us.  

 
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