HermeS® Hermetic Through Glass Via (TGV) Wafer

SCHOTT HermeS® is a glass substrate with hermetically sealed solid “Through Glass Vias” (TGV). It enables fully gastight and therefore long-term robust enclosures for MEMS devices. The fine-pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. Since HermeS® can be placed directly under the silicon MEMS, it enables miniaturized, fully hermetic 3D Wafer Level Chip Size Packaging (WLCSP).
Trade Fairs & Events
13.
March
Trade fair OFC 2018, San Diego, CA, USA, 13.03 - 15.03.2018
17.
September
Trade fair Gastech, Barcelona, Spain, 17.09 - 20.09.2018
13.
November
Trade fair electronica, Munich, Germany, 13.11 - 16.11.2018
Contact
SCHOTT AG
Christoph-Dorner-Strasse 29
84028 Landshut
Germany
E-Mail to SCHOTT+49 (0)871/826-0
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