SCHOTT HermeS® is a glass substrate with hermetically sealed solid “Through Glass Vias” (TGV). It enables fully gastight and therefore long-term robust enclosures for MEMS devices. The fine-pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. Since HermeS® can be placed directly under the silicon MEMS, it makes miniaturized, fully hermetic 3D Wafer Level Chip Size Packaging (WLCSP) possible.
Advantages of HermeS® compared to TSV (Through Silicon Vias)
This results in:
~ 80% foot print reduction compared to ceramic package
Our hermetic through glass vias can be used for a wide variety of MEMS applications such as:
SCHOTT HermeS® uses glass-to-metal sealing (GTMS) technology to provide superior hermeticity in a wafer-scale packaging solution. Please contact us for more information.
Forms of Supply and Product Packaging
Please contact us for a detailed discussion about your requirements.
For more information, please refer to our quality assurance processes .