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06.10.2014, SCHOTT AG, Landshut

Hermetic high-frequency packaging from SCHOTT for applications up to 80 GHz

High-performance packaging with HTCC feedthroughs and microwave housings with optimized high-frequency connectors specially tailored to meet customer requirements

Landshut (Germany), October 6, 2014 – The international technology group SCHOTT, with its Electronic Packaging Business Unit that specializes in glass-to-metal and ceramic-to-metal seals, offers a wide variety of packaging solutions for use in high-frequency applications. High-frequency feedthroughs based on HTCC multilayer ceramic are extremely compact and allow for highly miniaturized assembly and connection technology for bandwidths up to 40 GHz. SCHOTT also offers microelectronic housings with customer-specific geometry optimized SMA, SMP and SMPM connectors, which, depending on the design, are even suited for high-frequency applications up to 80 GHz in special cases. These components are used in radar technology, satellite communications, astronautics and space exploration. SCHOTT will be presenting its range of packages and feedthroughs at the European Microwave Week in Rome from October 7 – 9 (booth 196).
For optimal coupling of high-frequency signals, SCHOTT offers customized adjustments of the geometries of SMA, SMP and SMPM connectors to provide high-frequency packaging for applications with bandwidths up to 80 GHz. Image: SCHOTT
For optimal coupling of high-frequency signals, SCHOTT offers customized adjustments of the geometries of SMA, SMP and SMPM connectors to provide high-frequency packaging for applications with bandwidths up to 80 GHz. Image: SCHOTT
Sensitive electronic components require reliable protection, particularly in the high-frequency range. Increasing miniaturization poses further challenges to the design of the parts, however. These problems can be solved by using HTCC (High Temperature Cofired Ceramics) ceramic multilayer feedthroughs to achieve an extremely compact yet powerful connection between a large number of electrical feedthroughs to produce a hermetically sealed unit.

“We work closely with our customers to develop and manufacture HTCC feedthroughs with excellent high-frequency characteristics in terms of insertion loss, reflection loss and crosstalk thanks to their innovative designs,” explains Dr. Thomas Zetterer, Development Engineer at SCHOTT Electronic Packaging. Depending on the design, this can be achieved for a bandwidth up to 40 GHz. The thermal conductivity of the high-frequency packaging that many applications in the area of aerospace technology require can be achieved by using the right combination of materials and geometries. HTCC high-frequency feedthroughs from SCHOTT not only meet the typical design rules for HTCC ceramics but can also be realized in a reasonable manufacturing requirement regime.

Standard connectors often do not meet the high requirements for connectors that are used to couple high-frequency signals into high-power packages. Here, SCHOTT also offers hermetic high-frequency SMA, SMP and SMPM connectors based on glass-to-metal technology in modified geometries to ensure that the interfaces of the microwave packages deliver the required high-frequency performance. They can even be customized to meet individual requirements. The company always delivers its connectors together with a housing that they are hermetically soldered to. “We can supply hermetic microwave packages for high-frequency applications with bandwidths up to 80 GHz by optimizing the high-frequency connectors to suit our customers’ needs,” explains Michael Tratzky, Sales Manager for Opto-Electronics at SCHOTT Electronic Packaging.

With 130 years of history in the area of specialty glass and over 70 years of experience in manufacturing hermetic seals and feedthroughs, SCHOTT has all the know-how it needs to manufacture components that are perfectly adapted for high-frequency applications.

More information can be found here: www.schott.com/epackaging

Photo download link: http://www.schott-pictures.net/presskit/258457.hermetic-high-frequency-packaging

SCHOTT is an international technology group with 130 years of experience in the areas of specialty glasses and materials and advanced technologies. SCHOTT ranks number one in the world with many of its products. Its core markets are the household appliance, pharmaceutical, electronics, optics, and transportation industries. The company is strongly committed to contributing to its customers’ success and making SCHOTT an important part of people’s lives with high-quality products and intelligent solutions. SCHOTT is committed to managing its business in a sustainable manner and supporting its employees, society and the environment. The SCHOTT Group maintains close proximity to its customers with manufacturing and sales units in 35 countries. Its workforce of 15,400 employees generated worldwide sales of approximately 1.84 billion euros for the 2012/2013 fiscal year. SCHOTT AG, with its headquarters in Mainz (Germany) is owned by the Carl Zeiss Foundation.



Media contact:

SCHOTT AG
Dr. Haike Frank
Public Relations Manager
Hattenbergstrasse 10, 55122 Mainz, Germany
Phone: +49 (0)6131/66-4088
E-Mail: michael-matthias.mueller@schott.com
www.schott.com
Thanks to their innovative designs, high-frequency packages with HTCC feedthroughs from SCHOTT have excellent properties in terms of insertion loss, reflection loss and crosstalk. Image: SCHOTT
Thanks to their innovative designs, high-frequency packages with HTCC feedthroughs from SCHOTT have excellent properties in terms of insertion loss, reflection loss and crosstalk. Image: SCHOTT
Press contact
SCHOTT AG
Michael Müller
PR Manager
Hattenbergstraße 10
55122 Mainz
Germany
Phone: +49 6131/66-4088
Further information
SCHOTT AG
Salvatore Ruggiero
Vice President Marketing and Communication
Hattenbergstraße 10
55122 Mainz
Germany
Phone: +49 6131/66-4140
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