The boom in opto-electronics and the trend towards ever higher data transmission rates has led to increased demands on electronic devices as well as its electronic packaging solutions. Opto-electronic devices and modules are expected to provide superior performance and a long lifetime. This means that the packaging has to correspondingly offer a high degree of functionality as well as complete protection against exposure to harmful gases and environmental influences. Here, electronic packaging solutions including SCHOTT’s multilayer ceramics (H/LTCC, High/Low Temperature Cofired Ceramic) can present significant advantages.

SCHOTT H/LTCC high frequency feedthroughs enable fast data transmission rates of more than 40 gigabits/second. In addition, the electrical layout of these ceramic feedthroughs is widely variable, three dimensional and provides coplanar interfaces. Complex and customized packaging solutions which also include optical and thermal interfaces, especially for – but not restricted to - fiber optic applications, can be integrated using sophisticated soldering processes with glass or metal solder.

To find out more about SCHOTT’s HTCC and LTCC design rules, please refer to the new information sheets “Design rule for Low Temperature Cofired Ceramics (LTCC) substrate” and “Design rule for High Temperature Cofired Ceramics (HTCC) substrate“ available on SCHOTT CerTMS^® technology page. Alternatively, you could also contact us directly at any of our competence centers near you.