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Ultra-Thin Glass

Mechanical Properties

Mechanical Properties
D 263® T eco
AF 32® eco
Density 2.51 g/cm3 2.43 g/cm3
Knoop hardness 470 @ 0.1/20 580 @ 0.1/20
Young‘s modulus 72.9 KN/mm2 74.8 KN/mm2

The CTE of AF 32® eco and D 263® T eco

Thermal Properties

Thermal Properties
D 263® T eco
AF 32® eco
Tg 557 °C 717 °C
CTE (20 °C – 300 °C) 7.2 10 –6 · K–1 3.2 10 –6 · K–1
Thermal conductivity 1.06 W/mK @ 90 °C 1.16 W/mK @ 90 °C

Electrical Properties

Electrical Properties
D 263® T eco
AF 32® eco
Dielectric constant εr 6.7 @ 1 MHz
6.4 @ 1 GHz
6.3 @ 5 GHz
5.1 @ 1 MHz
5.1 @ 1 GHz
5.1 @ 5 GHz
Dissipation factor tan δ
0.006 @ 1 MHz
0.007 @ 1 GHz
0.010 @ 5 GHz
0.003 @ 1 MHz
0.004 @ 1 GHz
0.005 @ 5 GHz

Chemical Properties

Chemical Properties
D 263® T eco
AF 32® eco
Glass type Borosilicate Alumino-borosilicate
Hydrolytic resistance HGB 1 HGB 1
Acid resistance S2 S4
Alkaline resistance A2 A3
Alkaline free no yes

Examples of Competencies to Modify Ultra-Thin Glass (Under Development)
 

Structuring by Laser or Powder Blasting
to generate vias or microchannels

Laserstrukturierung von SCHOTT AF 32® eco

Example: laser structuring of SCHOTT
AF 32® eco, 100 μm thickness, via diameter: 30 μm, pitch: 50 μm

Optical properties of AF 32 ® eco and D 263® T eco
Chemical Strengthening
 

By chemical toughtening, the edge strength of D 263® T eco can be increased by a factor of 4.

Chemical strengthening of ultra-thin glass
Gas Barrier properties of ultra-thin glass
Carrier Solutions



SCHOTT can provide access to cooperation partners providing semicon standard handling solutions for ultra-thin glass to be handled on carriers with an adhesive bonding systems.

SCHOTT is developing adhesive free bonding solutions of ultra-thin glass to glass carriers for wafer and sheet form factors. 


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