SCHOTT is one of the world’s leading glass wafer suppliers. Its thin and ultra-thin glass wafers and substrates are made of different materials in sizes of between 4" and 12" and have various surface qualities and customized features.
What makes SCHOTT's wafer offerings unique are its proprietary production processes, selection of materials, and state-of-the-art processing capabilities.
- Edge treatment
- Ultra-sonic washing
- Clean room packaging
Glass wafer processing options
We are capable of meeting and exceeding all industry standards and customer requirements thanks to our state-of-the-art polishing operations and long years of experience in polishing thin glass.
Thanks to its use of powder blasting technology and the ultra-sonic lapping process, SCHOTT
has access to a wide variety of capabilities when it comes to providing specific solutions for structured
Thanks to our expertise in ultra-sonic washing under clean room conditions, we are able to achieve extremely high precision and supply high-quality products to the semiconductor industry.
Our expertise in ultra-sonic washing under clean room conditions enables us to provide the highest precision and to deliver products to the semiconductor industry.
- High cleaning results with sour and alkaline cleaners
- End cleaning with DI-water
- Drying using infrared lamps
- Located in a clean room (class 1000) and packaging takes place in flow boxes (class 100)
SCHOTT's glass washing process
All wafers are inspected (class 1000) using special measurement and testing devices during clean room manufacturing and under clean room conditions (class 1000). They can be packaged for shipping in wafer shipment boxes (flow boxes) under clean room conditions.
- Manufacturing facilities are ISO 9001-certified
- Quality control in accordance with ISO 9001:2000
- Material traceability guaranteed